1. System have GPIB and Ethernet communication facility.
2. DC source resolution: 5 bits+ sign
3. AC current from 4 mA to 210mA.
4. Frequency 1 MHz to 100 KHz.
5. Voltage Compliance: 100 V
6. Responsetime:1-20 µs

1. Sessile drop, Pendant drop (by computer image analysis system)
2. Contact angle:ᶿ/2 method, Tangent method, Circle & Ellipse fitting Surface / Interfacial tension: ds / de method, Young Laplace method
3. Contact angle: 0-180°
4. Surface/Interfacial tension: 0- 100mN/m
5. Contact angle: 0.01°Surface/Interfacial tension: 0.01 m N/m
6. Contact angle: 0.3° Surface/Interfacial tension: 0.3 mN/m
7. (Repeatability described in standard deviation)
8. 100 mm (W) x 100 mm(D) x 10 mm(H), max, weight 300 g
9. Z-axis 10.5 mm by manual knob rotation manual dispensor with knob rotation
10. By stage up/down movement
11. Ambient: ±1°C
12. USB bus power.
13. DC5V, 2Wmax
14. 170mm (W) x 346mm (D) x 283 mm(H), Approx. Weight 2.6 kg
15. Temperature: 10 ° - 35° C, Relative humidity: 30-80% (non-condensing) Away from sources of electrical noiseand vibration.

1. Maximum Temperature:1600°C
2. Operating Temperature:1400°C
3. Power rating:2.5 kW
4. Heating rate: 1 to 20 ° C/min programmable
5. Measuring Range:0 to 2000microns
6. Specimen Size: 5to 20 mm dia. And 50mm length
7. Repeatability and accuracy: ± 0.1 %

Make: Digital LEEB Hardness Testing Machine

Model: L 3

1. Hardness Scale: HB, HRA, HRB, HRC and HV
2. Large Screen (128x64 dot Matrix x LCD), showing all functions and parameters With LCD Display with large Screen(128x64)
3. 6V-NI-MH rechargeable battery Operating Temperature –10°C – 40°C
4. Dimension: 210 mmx 85 mm x 45 mm (main unit)
5. Weight : 0.6KG approx.

1. Supply voltage: 230V AC
2. Pump/speed control: Vacuum base flow pump/ Electronic
3. Polishing voltage:0 – 60 V
4. Polishing current:0 – 3 Amp
5. PolishingTimer:0– 90 sec
6. Etchingvoltage:0– 18V
7. EtchingTimer:0– 90sec

1. Pneumatic mounting press- semi automatic type, Two moulds can be produced at time.
2. Suitable Air Compressor.
3. LCD Display of temperature and Timer.
4. Quick ram return to speed up reloading and automatic
5. Cycle system
6. Automatic Water-Cooling System.
7. Buzzer indication of End of Cycle.
8. 1.1/4 ” Mold Chambers
9. Provision to accommodate 1”, 1.1/2”, 1.1/4”, 30 mm and 40 mm Mould sizes.
10. Suitable for Bakelite, Phenolic Resins.

1. Inner Size:450mm X 600 mm X 450 mm (W x H XD)
2. No. of Shelves: 2 Nos.
3. Rating: 2. 5KW
4. Temperature Range: 5 deg. C above ambient to 250 °C with a sensivity of ± 2 °C
5. Power Supply:220 V 1 Phase, 50 Hz, AC supply

1. Size: 4” x 4” x 9”
2. Maximum Temperature:1200°C
3. MOC: Inner SS, Outer MS Powdered Coated
4. Power Rating: 1.8 KW
5. INO PID Controller with CR/ AR Sensor

1. Rotation speed:0– 200rpm
2. PID Controller
3. Temperature: 5-60°C
4. Accuracy: ± 1°C
5. Overload Protector Size : 400mmx400 mm x 800mm
6. Capacity: 1ltr

1. Rotors: 6 mm x10 mm (Swing)
2. Max. Speed: 4000 rpm
3. Speed Setting: 1– 999mins
4. Programs Storage: 99
5. Lock Safety
6. Imbalance detection
7. Centrifuge tubes (10 mL-10 Packs)
8. Chamber diameter: 8 m (or)above
9. Power: 180W max

1. Wavenumber range, with standard DLaTGS detector 7800 to 350 cm-1
2. Optional NIR and Far IR options with fixed beam splitter and two detector positions
3. Comprehensive range of sampling accessories with IQ Accessory recognition for solids, liquids and gases
4. Built-in automated validation with polystyrene and glass filters
5. Vibration-proof optical bench
6. Large sample compartment
7. Corner-cube (retro-reflective) mirrors with automatic energy alignment
8. Individually purgeable sections: interferometer, sample compartment and detector housing
9. High sensitivity DLaTGS detector
10. Options for FTIR microscopy and IR Imaging
11. Rapid scan with interval scan for fast kinetic measurement
12. Wavenumber extension for NIR, mid-IR and far-IR
13. Optional 21 CFR part 11, IQ OQ and GxP compliance